Product Introduction：
This product is capable of both cooling and heating functions. The cooling function effectively addresses issues such as thermal runaway, severe capacity degradation, and product lifespan reduction caused by excessive temperature during battery charging and discharging. The heating function effectively resolves the problem of batteries not being conducive to charging and discharging in low-temperature environments and cold regions, ensuring normal battery charging and discharging, and allowing the battery to operate efficiently within an appropriate temperature range.
The product includes a refrigeration and heating circuit and a battery pack cooling water circuit, with the two circuits exchanging heat through a plate heat exchanger (Chiller). The refrigeration circuit generates low temperatures, and the battery pack cooling water circuit cools the battery pack, after which the cooling water is heated and then cooled again through the plate heat exchanger, achieving dynamic equilibrium and ultimately cooling the battery. The refrigeration system module consists of components such as a compressor, condenser, plate heat exchanger, and throttle valve; the water circuit module consists of components such as a water pump, PTC heater, and water pipes!
Core advantages:
Efficient heat dissipation: The specific heat capacity of water is about 4 times higher than that of air, making it easy for a single cabinet to support high computing power scenarios of 30kW+.
Compact layout: The compact design reduces the overall height, making it suitable for installation at the bottom of equipment or in situations where space height is limited.
Low noise: Compared to large fans with the same heat dissipation capacity, liquid cooling systems mainly generate noise from water pumps and a small number of fans, which are usually quieter.
Accurate temperature control: It can achieve liquid temperature control with ± 0.5 ° C or even higher precision, ensuring that the cooled equipment is at the optimal working temperature.
Long distance heat transfer: The coolant can be transmitted through pipelines to a longer distance, dissipating heat to a more suitable location (such as outdoors) and optimizing the computer room environment.
Product functional features：
This product is capable of achieving both cooling and heating functions. The cooling function effectively addresses the issue of overheating caused by batteries during the charging and discharging process
Issues such as thermal runaway, severe battery capacity degradation, and product lifespan attenuation; the heating function effectively addresses the challenges posed to batteries in low-temperature environments and cold regions
Regarding the issue of charging and discharging, it ensures that the battery can be charged and discharged normally, allowing it to operate efficiently within an appropriate temperature range.
This product includes a refrigeration and heating circuit as well as a battery pack cooling water circuit, with heat exchange between the two circuits facilitated by a plate heat exchanger (chiller); manufacture
The cold loop generates low temperature, and the battery pack cooling water loop cools the battery pack, after which the cooling water is heated and then cooled again through a plate heat exchanger
Achieve dynamic equilibrium and ultimately achieve cooling of the battery. The refrigeration system module consists of components such as a compressor, condenser, plate heat exchanger, and throttle valve
Composition: The water circuit module consists of components such as a water pump, PTC heater, and water pipes.
main components：
liquid cooling pipe
liquid-cooled plate：
Detailed specifications：
project | Parameter requirements |
Dimensions (Depth * Width * Height) | 880*440*2000mm |
Total mass | <450KG |
refrigeration capacity | > 30KW@45 ° C, 18 ° C water temperature |
PTC heating capacity | Built in, 15KW |
coolant | 50% water+50% ethylene glycol (optional) |
refrigerant | R410a |
Refrigerant filling amount | 5Kg+0.03kg |
Refrigerant leakage rate | <3g/year |
COP | twenty-two point five |
input power | <12253W |
Operating Temperature | -40° C~55° C |
noise | Compressor 6000rpm, distance 1m, noise ≤ 78dB (A) |
Compressor drive power supply | AC380V |
Water pump drive power supply | DCS5oV |
Protection level of electrical appliances inside the unit | IP56 |
Corrosion resistance level | C3H (regular), can be customized with high-grade C5HGB/T 19845-2005/IS0 10055:1996 |
Vibration requirements | GB/T 19845-2005/ISO 10055:1996 |
insulation characteristics | DC2500V,>50MQ |
Voltage endurance characteristics | Voltage 2000VDC, testing time 1min, leakage current<40mA, no breakdown, flashover or arcing phenomenon |
grounding resistance | The resistance between the metal casing of the unit and the grounding terminal is less than 0.1Q |
Water supply temperature range | Adjustable from 5 degrees to 60 degrees |
pump flow rate | 400L/ min@220kpa |
Temperature control accuracy | 士1°C |
Temperature stability | 士1°C |
flow control | Infinite speed regulation, linear control |
Design water pressure resistance | 0.8Mpa |
Material/color of water-cooled casing | Industrial gray color code RAL7035 (adjusted according to customer needs) |
Working voltage range of high-voltage power supply | AC:320~460 (380V)/AC:320~540 (440V) |
Low voltage power supply operating voltage range | DC:16V-32V |
Outer diameter of return liquid interface pipe | Medium diameter 63mm (chuck outer diameter 77.5mm) |
Outer diameter of liquid supply interface pipe | Medium diameter 63mm (chuck outer diameter 77.5mm) |
Installation method | Vertical installation |
Installation size communication method | See the drawing |
Requirements for altitude and humidity during unit operation | Can2.0 or RS485 |
Installation size communication method | <4000m |
Requirements for altitude and humidity during unit operation | <95% |
Maximum current | 40A |
Application Scenario:
High-performance computing servers/GPU servers: Address the challenge of centralized cooling for CPUs and GPUs.
High-power laser processing equipment: Provides a stable and low-temperature operating environment for the laser device.
Power electronic devices: such as frequency converters, inverters, radar transmitters, etc.
Medical and scientific research equipment: MRI, accelerator, spectrometer, and other temperature-sensitive equipment.
Communication core equipment: core network equipment for 5G base stations, high-end routers, etc.
